Investigator Pan Jiutang uncovered on Weibo today the MediaTek Helio X30 chipset will be fabricated utilizing a 10nm assembling process. As indicated by him, the Helio X30 will accompany ten CPU centers - the Cortex-A35 will be utilized for non-requesting assignments, while the hard work will be finished by the yet unreleased "Artemis".
Moreover, the X30 will bolster up to 8GB of RAM and accompany a PowerVR GPU. Jiutang likewise gives a daftar harga hp lenovo terbaru presentation slide, which demonstrates the MediaTek Helio X30 scores 160,000 focuses on the Antutu benchmark, beating the Snapdragon 820 by 30,000.
MediaTek's arrangements the Helio X30 to be its leader chipset for 2017. The expert uncovers that until then the organization plans to improve power utilization. There are no points of interest on which gadgets will utilize the up and coming chipset.
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